SIRIUS - Mobile Phones and Software
| Developing
software coded mobile phone chips and intelligent components for European vendors — Sirius stages its investments to cope with unavailability of political risk guarantees to investors working with its partner Annova Ltd. (UK). Company: Sirius JSC Amount: $500,000 (Phase I — design work and training); $4.7 million (Phase II — trial production; international certification) Higher investment levels have been sought and discussed with prospective investors. Tenor/Terms: To be decided Higher levels of investment require investors to be guaranteed against any transfer restrictions, expropriation, breach of contract, war and or civil disturbances. Documentation: A detailed business proposal for larger scale production facility being investigated by investor partners of Annova can be reviewed with prospective investors. Use of Funds: Design $0.2 m Training $0.3 m Certification $0.3 m Equipment $4.4 m (Facility expansion for large scale production estimated up to $10 m) Legal Status: Joint Stock Company Strategic Partners: The main partner of Sirius JSC is Annova Ltd.which already finances a part of the first stage with equity investment. At the same time Sirius collaborates with Wintex Ltd. and its other partners include Atlantic Electrics (UK), Anand International Ltd, Lexus Telecom Ltd, Ag International (RSA); Shankar s Emporium (Singapore). Current Operations: Currently Sirius designs and tests electronics and software. It has an arrangement with Annova Ltd. to market software products as well as Sirius’ capabilities in software programming in Europe and USA. Sirius has already done various projects for other companies in e-Commerce, call billing systems, software packages for product delivery systems, web graphic design, erasing and re-programming chips, WAP Technologies. Annova Ltd. finances a part of the first phase of the proposed design and software development project that focuses on mobile phone software and intelligent components. Sales and Marketing Plan: As the global mobile phone markets restructure due to competition, Sirius plans to focus on expanding in the niche low-cost components and software market where own programs need to be developed, integrated into components and sold to vendors of quality mobile phone systems in Europe. Through Annova’s prospective clients and partners a wide range of market contacts are available to Sirius in Europe, Middle East, far East and USA. Regionally, Sirius plans to initially penetrate markets in Turkey, Iran and Russia. In the event high quality production levels compatible with international standards are achieved, investor-partners of Annova could easily market higher volumes. While there are no plans to enter the large scale production of mobile phones unless investment and buying arrangements are secure, the design, software development and certified production of components are in themselves expected to be significant revenue earners to attract low-cost producers from Far East. Business Plan: Sirius has already started the First Phase, partly financed by Annova. An additional $500,000 will complete Phase I that will design the software, develop the chip and the molding and acquire certification of international component buyers and OEMs in Europe. Other Project Details: Sirius JSC was founded in 1963 as a scientific production facility for electronic components, electric devices, modulators and programming devices. It currently produces programming chips - EPROM, EEPROM, PROM 27CXX and 28CXX series, The Universal Programmer for Intel Micro controller (IMCS-48, IMCS-51, IMCS-96), programming debugging hardware-software system with emulator for Intel micro controllers MCS-48, MCS-96 and Intel 8086, 8088 processors. In addition it produced electronic components, such as resistors, varistors and PCB. Its staff is highly qualified in mathematics, software programming and electronics. In software -- C/C++, SQL, CGI Scripts, ASP, PHP3, Java, JavaScript, VBScript, HTML & DHTML, Flash, XML & XSL, CSS, etc. with a strong complement of object oriented approach, relational database development, client/server technology, and application design. Languages: Microsoft Assembler 6.0, Turbo Assembler, Clipper 5.2, Visual Basic 6.0, Turbo Pascal, Visual J++, jdk Java, Jscript, VBSscript, HTML & DHTML 4.0, XML, XSL, C, C++, Perl, PHP3, UNIX Shell Scripting, SQL. Thus current operations of Sirius allow it to take on emerging web and communications programming and software development in combination with electronic component developments. Its skilled expertise set in software and electronics allows it to integrate them and produce intelligent electronic components with extreme sophistication. It also produces moulds for plastic parts, like audio-cassette, videotapes, TV cabinet and others. This gives it a skill complement that bodes well for eventually manufacturing new technology products like CD ROMS, AV remotes, mobile phone components etc. In addition Sirius can develop other products using the following technologies fundamental to world-class electronics manufacturing: • Integral circuit - crystal, obtained through planner technology (photolithography, dusting), is assembled in metal base through micro welding and hermetically sealed off; • Integral Hybrid Schemes: The components, through micro welding, are mounted on glass ceramic board, which is obtained through planner technology and hermetically sealed off; • Dies-crystal: obtained through planner technology is mounted on metal pins through micro welding and hermetically sealed by plastic. • Printed Circuit Board - Single layer, double side and multi layer-- are made of epoxy glass (drilling, moralizing, routing and photolithography), using film photo resist, film and liquid masks and are tested. Resistors- Ceramic pipe, after treatment, metallized by dusting with special alloys and reinforced by pins, colored, ring-shape marked. • Variable Resistors - 0.25, 0.5 and 1.0 Watt. Wire resistive element (obtained through loading) together with rotary contact. Unit is assembled on plastic basis, enforced by pins and is placed within the enameled body. Mould, stamps are made of various materials (steel, aluminum). • Galvanization -Nickel plating; zinc plating; tin plating; copper plating; chromium plating; anodic oxidization, chemical oxidization technologies. Points of Contact: Mr. Hayk Mezhlumyan, President SIRIUS 11, Sevan St. 378510 Abovyan Armenia Tel: 374-22- 2 41 51 Fax: 374-22- 2 33 97 E-mail: sirius@sirius.am URL: http://www.sirius.am Mr. Shandip Popat Annova Ltd. 48 Trinity House Heather Park Drive Middlesex HAO 1SX England Tel: 44-77-8-539-8637 Tel: 44-02-08-909-2694 Email: shan@annova.plus.com |